Re-releasing a processor seems like a simple task, but it’s not. The new AMD Ryzen 7 5800X3D 10th Anniversary Edition differs from the original by using new technologies, as the old ones are no longer used. This was told by David McAfee, AMD’s vice president and general manager of Radeon and Ryzen, to Tom’s Hardware.
“It’s not as simple as just bringing back the 5800X3D. The original stacking process that was used at TSMC changed when we went from first-gen to second-gen cache, so we had to re-engineer that product, and there actually was a fair amount of development that went into bringing back the 5800X3D,” McAfee said.
The Ryzen 7 5800X3D uses TSMC’s hybrid SoIC (System-on-Integrated-Chips) bonding technology. It uses a combination of hot and cold bonding to bond two silicon elements, with power being shared between them via through-silicon vias (TSVs). With the move to Ryzen 7000, AMD had to make some changes to the 3D V-Cache design, which were then carried over to Ryzen 9000. So the bonding technology changed from the first to the second generation X3D chips.
“It completely changed the characteristics of how those two pieces of silicon are bonded together and how they were stacked together, and so when that first-gen facility really kind of went offline, then it meant there was a whole, you know, body of engineering work that had to be done to understand if we could even migrate the 5800X3D to the new, second-generation stacking process,” McAfee says.
The change in packaging design explains the shortage of Ryzen 7 5800X3D and 5700X3D on the market. For the past two years, the processors have been hard to find, and in the past year they have been completely sold out – sellers have asked for up to $800 for used 5800X3Ds.
McAfee says there’s a lot of work “behind the scenes” re-qualifying the assembly process, prototyping, and testing. Engineers had to make sure the chips could be mass-produced using the new technology and “have the highest reliability for consumers.”
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