New Transceivers Enable AI Builders to Scale Compute Within the Same Network Footprint While Reducing Networking\u2019s Share of the Power Budget<\/p>\n
News Summary:<\/p>\n
\n\tUltra-Dense Small Form Factor Pluggable (USFP) is designed to be the first module to support 400Gb\/s-per-lane electrical signals, enabling capacity up to 12.8Tb\/s so AI factory builders can scale Ethernet AI fabrics, while extending a proven deployment model across multiple generations of data center networks.
\n\tUSFP delivers 4x the bandwidth density and 1.3x the power efficiency of 200Gb\/s-per-lane optics so AI factories can connect more computing systems without adding network tiers, while using less power to move each bit of data.
\n\tNVIDIA and Cisco are working with TE Connectivity and Amphenol to build a multi-source hardware ecosystem around USFP.
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NVIDIA and Cisco today announced plans for Ultra-Dense Small Form Factor Pluggable (USFP), a new high-density 400Gb\/s-per-lane optical module designed to equip the hardware ecosystem for the next generation of AI factories using pluggable transceivers.<\/p>\n
As AI models grow and inference demand expands, AI factories must connect more computing systems while managing network complexity, power and costs. Moving more data per watt and per switch helps operators make better use of their infrastructure investments.<\/p>\n
Scaling AI factories requires more bandwidth per connection and more connections per switch. When a switch reaches its capacity, further network expansion can require additional switch layers and optical links, increasing latency, power consumption and costs.<\/p>\n
USFP is designed to enable AI factory builders to scale from 200 Gb\/s per lane to 400Gb\/s-per-lane Ethernet AI fabrics, while extending a deployment model proven at scale across multiple generations of data center networks. With USFP, customers can embrace next-generation optical technology and meet the performance demand of AI workloads without overhauling their data center infrastructure.<\/p>\n
The first planned USFP-based transceivers will pack 16 full-duplex lanes in an octal small form factor (OSFP)-sized footprint supporting both switches and SuperNICs, with the ability to expand to 32 and more lanes in the future. By doubling both the lane count and bandwidth per lane, USFP enables AI fabrics to connect more 1.6Tb\/s endpoints without adding network tiers. Customers will be able to achieve 12.8Tb\/s of overall capacity with USFP.<\/p>\n
Comparable with an OSFP-sized module, it delivers 4x the bandwidth and front-panel bandwidth density, with approximately 1.3x the power efficiency, versus 200Gb\/s-per-lane pluggable modules. This means AI builders can increase their compute scale within the same network footprint, while decreasing networking\u2019s share of the overall AI factory power budget.<\/p>\n
\u201cBuilding the world\u2019s largest AI factories starts with rethinking the smallest of connections,\u201d said Gilad Shainer, senior vice president NVIDIA. \u201cWith USFP, NVIDIA and Cisco are building an ecosystem to reinvent pluggable optics \u2014 connecting more computing with greater efficiency to power the next generation of AI factories.\u201d<\/p>\n
\u201cAI builders need an interconnect architecture that can scale performance without locking them into a more complex operating model,\u201d said Bill Gartner, senior vice president and general manager of optical systems and optics at Cisco. \u201cCisco and NVIDIA recognized that scaling pluggable optics to 400Gb\/s per lane would require more than another incremental extension of today\u2019s module designs. Through our collaboration, USFP is designed to deliver a new level of bandwidth density while preserving the serviceability, deployment flexibility and operational simplicity of pluggable optics. By taking a full-stack approach \u2014 from silicon and systems to optics and the network operating system \u2014 we can optimize every layer to deliver the performance and scale the next generation of AI networks will require.\u201d<\/p>\n
More AI Infrastructure From Every Switch
\nDesigned for electrical signals of 400Gb\/s per lane, USFP uses a new two-dimensional array connector with a two-step insertion design that engages high-speed contacts after the module is inserted, reducing contact wear, improving signal integrity and making insertion force more predictable. The connector technology allows for further scaling of lane count to 32 full duplex lanes and more in the future. Because the connector is designed for 400Gb\/s performance, it also offers improved performance at 200Gb\/s per lane.<\/p>\n
USFP supports power dissipation of up to 100 watts without needing a separate, dedicated embedded cooling circuit within the transceiver, reducing switch design complexity and improving reliability. Together, these capabilities enable higher-bandwidth fabrics while preserving the mature deployment, serviceability and manufacturability of existing pluggable transceivers.<\/p>\n
All USFP configurations support optical designs that reduce latency and power consumption by simplifying signal processing. Support for a broad range of optical technologies and connection distances gives system designers the flexibility to meet unique AI factory deployment needs.<\/p>\n
A Hardware Ecosystem for Next-Generation AI Factories
\nNVIDIA and Cisco are collaborating with TE Connectivity and Amphenol to build USFP cages, connectors and modules, with additional partners expected to join. The shared form factor gives suppliers a common foundation for developing high-density pluggable infrastructure for 400Gb\/s-per-lane fabrics to build a robust ecosystem for AI factory builders.<\/p>\n