Xiaomi recently showed off its latest cooling setup in a live-streamed event, putting the REDMI K90 Max up against two other air-cooled phones. The idea was simple: stress the devices under heavy gaming and see how they hold up.
The test conditions were fairly demanding. The K90 Max was run through a 4-hour MOBA session at 144fps with maximum graphics. According to Xiaomi CEO Lei Jun, the phone reached a peak surface temperature of 36.7°C. For comparison, “competitor A” and “competitor B” reached 42.8°C and 39.0°C, respectively. The CEO didn’t name the devices, for obvious reasons. The CEO also noted that the phone uses a “large fan” and focuses on improving the airflow efficiency.
While he didn’t share details like the ambient temperature, the gap between the devices still gives a rough idea of how effective Xiaomi’s cooling system might be.
According to previous reports, the cooling fan is around 18.1mm in diameter, roughly 6% bigger than typical setups. Claimed airflow is around 0.42 CFM, with up to 40% better utilization, though it’s hard to compare directly without independent testing.
Another point mentioned in leaks is fan noise. The system is said to stay relatively quiet even under load, which is usually a concern with fan-based designs.
On the design side, the K90 Max is shown in a “Space Silver” finish, with a metal frame and slim bezels. The fan opening is integrated into the design, and it stands out visually as a key selling point of the phone. The phone also carries IP66, IP68, and IP69 ratings, suggesting the airflow system is sealed to protect internal components.
Whether those numbers hold up outside controlled demos is something we’ll only know once we get our hands on the device.
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(Source: Lei Jun on Weibo)