Texas Instruments (TI), a global leader in semiconductor innovation, introduced a suite of cutting-edge power-management solutions designed to meet the escalating power demands of artificial intelligence (AI) computing and enable scalable power architectures ranging from 12V to 800 VDC. The new offerings are showcased at the Open Compute Summit (OCP) 2025, held October 13-16 in San Jose, California, underscoring TI’s commitment to empowering next-generation AI data center architectures.
As AI workloads become increasingly complex, power requirements within IT racks are projected to surpass 1 megawatt in the next two to three years, necessitating revolutionary power delivery systems. In partnership with NVIDIA and other industry leaders, TI is pioneering power-management devices and design resources to facilitate this transition, optimizing for efficiency, power density, and reliability.
Innovative Power Solutions Highlighted at OCP 2025
White Paper on AI Power Delivery Trade-offs: TI and NVIDIA collaborated on a comprehensive white paper titled “Power delivery trade-offs when preparing for the next wave of AI computing growth.” This resource reexamines traditional power architectures within IT racks, discussing the design challenges and opportunities to achieve high-efficiency, high-density power conversion at a system level.
30kW AI Server Power-Supply Reference Design: TI introduced a sophisticated dual-stage power supply design featuring a three-phase, three-level flying capacitor power factor correction converter combined with dual delta-delta three-phase inductor-inductor-capacitor converters. This versatile power supply supports either a single 800V output or multiple separate outputs, tailored to meet stringent AI workloads.
High-Density Dual-Phase Smart Power Stage: The CSD965203B offers a peak current of 100A per phase in a compact 5mm x 5mm package. This device enables increased phase counts and enhanced power delivery within constrained PCB spaces, improving overall efficiency and performance.
Compact Dual-Phase Smart Power Module: The CSDM65295 module delivers up to 180A peak output current in a small 9mm x 10mm x 5mm footprint. It integrates two power stages and inductors with trans-inductor voltage regulation (TLVR), ensuring high efficiency and robust thermal management critical for dense AI power systems.
Gallium-Nitride Intermediate Bus Converter: TI’s LMM104RM0 converter provides up to 1.6kW output power with over 97.5% conversion efficiency. Its quarter-brick form factor and high light-load efficiency enable effective active current sharing between modules, making it ideal for scalable AI power systems.
Why This Matters for AI Infrastructure
Modern AI data centers demand sophisticated power-management solutions that integrate seamlessly from grid power generation to GPU-level logic circuits. TI’s broad portfolio of devices and design resources facilitates this, addressing challenges such as heat dissipation, power density, and efficiency at scale.
“AI workloads are transforming data centers into complex power infrastructure hubs,” said Chris Suchoski, Sector General Manager, Data Centers at Texas Instruments. “Our scalable power solutions empower designers to build innovative systems that drive the evolution to 800 VDC architectures, meeting tomorrow’s AI power needs with enhanced efficiency and reliability.”
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