HBM Becomes Testbed For 3D Assembly Yield
Key Takeaways: DFT is increasingly critical for detecting defects in memory cells, TSVs, microbumps, and high-speed interfaces, while…
The Architecture Decisions Behind A Production-Ready EDA AI Agent
The conversation about agentic AI in semiconductor and PCB design tends to focus on capability: what the agent…
AI Starting To Simplify Design Of Programmable Logic
Key Takeaways AI/ML and agentic tools are getting better at helping design and compile FPGAs, but downstream programming…
China’s semiconductor firms post hefty 2025 profits amid AI boom, tech self-reliance drive
Enterprises across China’s semiconductor industry recorded hefty profit growth last year, according to their unaudited financial results, driven…
Addressing Critical Tradeoffs In NPU Design
Experts At The Table: AI/ML are driving a steep ramp in neural processing unit (NPU) design activity for…
China’s chip leaders bank on AI, EVs, RISC-V as industry’s future growth engines
The use of chips for artificial intelligence and electric vehicles (EVs) will offer strong demand underpinning the development…