Senior Chinese semiconductor executives said AI-driven demand is creating bottlenecks across equipment, passive components, and workforce capacity, according to a DigiTimes report from the SEMI Industry Innovation Investment Forum at SEMICON China 2026, which ran March 25-27 in Shanghai.

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China’s Big Fund Phase II. The company is building the first Chinese 12-inch wafer fab in Chongqing’s Xiyong Microelectronics Industrial Park with an initial capacity target of 20,000 wafers per month, focused on automotive-grade chip production.

Panelists also discussed international expansion. Wang said sustained investment and market scale are critical to global competitiveness, with differentiated technologies forming the foundation of that. Li acknowledged that geopolitical constraints persist but said companies can reach overseas customers by delivering value, with domestic competition increasingly pushing firms toward export markets.

The panelists were all in agreement that AI will continue to drive capital expenditure growth, with sustained investment and AI-driven manufacturing upgrades essential to maintaining competitiveness.

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