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Samsung pushes new thermal packaging to win back Qualcomm and Apple - digitimes
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Samsung pushes new thermal packaging to win back Qualcomm and Apple – digitimes

  • December 15, 2025

Samsung pushes new thermal packaging to win back Qualcomm and Apple  digitimesSamsung’s Proprietary “Heat Path Block” Tech Could be Adopted by Apple & Qualcomm  TechPowerUpThis Exynos 2600 feature might keep future Snapdragon chips from running hot  Android AuthoritySamsung’s Heat Dissipation Tech For Exynos 2600 Might Soon Feature Within Apple Silicon And Qualcomm’s Snapdragon Chips  Wccftech

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