The Architecture Decisions Behind A Production-Ready EDA AI Agent
The conversation about agentic AI in semiconductor and PCB design tends to focus on capability: what the agent…
Multi-die Testing In The Field Must Build On Established Test Methodologies
Key Takeaways: In-system testing is the very best way to ensure the longevity of data center and automotive…
AI Starting To Simplify Design Of Programmable Logic
Key Takeaways AI/ML and agentic tools are getting better at helping design and compile FPGAs, but downstream programming…
How Siemens Symphony Pro Enabled AnalogPort To Verify Complex Chip Interfaces
The semiconductor industry’s shift toward chiplet-based architectures has created significant mixed-signal verification challenges for high-speed die-to-die interconnects. Traditional…
China’s semiconductor firms post hefty 2025 profits amid AI boom, tech self-reliance drive
Enterprises across China’s semiconductor industry recorded hefty profit growth last year, according to their unaudited financial results, driven…
Balancing Training, Quantization, And Hardware Integration In NPUs
Experts At The Table: AI/ML is driving a steep ramp in neural processing unit (NPU) design activity for…
Addressing Critical Tradeoffs In NPU Design
Experts At The Table: AI/ML are driving a steep ramp in neural processing unit (NPU) design activity for…
China’s chip leaders bank on AI, EVs, RISC-V as industry’s future growth engines
The use of chips for artificial intelligence and electric vehicles (EVs) will offer strong demand underpinning the development…