{"id":547536,"date":"2026-07-28T08:10:18","date_gmt":"2026-07-28T08:10:18","guid":{"rendered":"https:\/\/www.newsbeep.com\/nz\/547536\/"},"modified":"2026-07-28T08:10:18","modified_gmt":"2026-07-28T08:10:18","slug":"ai-chip-boom-shifts-bottleneck-to-advanced-packaging-says-ats-ceo","status":"publish","type":"post","link":"https:\/\/www.newsbeep.com\/nz\/547536\/","title":{"rendered":"AI chip boom shifts bottleneck to advanced packaging, says AT&#038;S CEO"},"content":{"rendered":"<p><a class=\"ArticleTag_articleTag__P1Zo7\" href=\"https:\/\/asia.nikkei.com\/business\/tech\/semiconductors\" data-trackable=\"primary-tag\" data-dark-mode=\"false\" rel=\"nofollow noopener\" target=\"_blank\">Semiconductors<\/a><\/p>\n<p class=\"NewsArticleHeader_newsArticleHeaderSubtitle__ZlvPp\" data-trackable=\"subhead\" data-dark-mode=\"false\">Austrian company expands Malaysia operations as AI demand outpaces substrate capacity<\/p>\n<p><img decoding=\"async\" class=\"image-main img-fluid ImageNew_imageNewImageResponsive__f1VTu\" src=\"https:\/\/www.newsbeep.com\/nz\/wp-content\/uploads\/2026\/07\/https:\/\/cms-image-bucket-productionv3-ap-northeast-1-a7d2.s3.ap-northeast-1.amazonaws.com\/images\/0\/1.jpeg\" alt=\"20260727 AT&amp;S CEO\" width=\"780\" height=\"auto\" loading=\"eager\"\/><\/p>\n<p class=\"NewsArticleCaption_newsArticleCaption__fxo8v\" data-trackable=\"caption\" data-dark-mode=\"false\" style=\"display:block\">Michael Mertin, chief executive of Austrian substrate supplier AT&amp;S, says AI chips have increased the complexity of vendor-supplier relations. &#8220;You have to cooperate, you have to think, you have to have a joint roadmap.&#8221; (Source photos by Norman Goh and AT&amp;S Facebook page)<\/p>\n<p data-dark-mode=\"false\" class=\"Paragraph_paragraph__2p1wC\">PENANG, Malaysia &#8212; The global artificial intelligence boom is creating a new bottleneck in semiconductor manufacturing as demand for advanced chip packaging services and substrates outstrips supply, according to Austrian supplier AT&amp;S.<\/p>\n","protected":false},"excerpt":{"rendered":"Semiconductors Austrian company expands Malaysia operations as AI demand outpaces substrate capacity Michael Mertin, chief executive of Austrian&hellip;\n","protected":false},"author":2,"featured_media":547537,"comment_status":"","ping_status":"","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[20],"tags":[24928,365,363,364,112055,16424,113966,3500,3028,111,139,69,29737,312,84628,145],"class_list":["post-547536","post","type-post","status-publish","format-standard","has-post-thumbnail","category-artificial-intelligence","tag-advanced","tag-ai","tag-artificial-intelligence","tag-artificialintelligence","tag-ats","tag-boom","tag-bottleneck","tag-ceo","tag-chip","tag-new-zealand","tag-newzealand","tag-nz","tag-packaging","tag-says","tag-shifts","tag-technology"],"_links":{"self":[{"href":"https:\/\/www.newsbeep.com\/nz\/wp-json\/wp\/v2\/posts\/547536","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.newsbeep.com\/nz\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/www.newsbeep.com\/nz\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/www.newsbeep.com\/nz\/wp-json\/wp\/v2\/users\/2"}],"replies":[{"embeddable":true,"href":"https:\/\/www.newsbeep.com\/nz\/wp-json\/wp\/v2\/comments?post=547536"}],"version-history":[{"count":0,"href":"https:\/\/www.newsbeep.com\/nz\/wp-json\/wp\/v2\/posts\/547536\/revisions"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/www.newsbeep.com\/nz\/wp-json\/wp\/v2\/media\/547537"}],"wp:attachment":[{"href":"https:\/\/www.newsbeep.com\/nz\/wp-json\/wp\/v2\/media?parent=547536"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/www.newsbeep.com\/nz\/wp-json\/wp\/v2\/categories?post=547536"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/www.newsbeep.com\/nz\/wp-json\/wp\/v2\/tags?post=547536"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}