{"id":72534,"date":"2025-10-11T19:32:09","date_gmt":"2025-10-11T19:32:09","guid":{"rendered":"https:\/\/www.newsbeep.com\/nz\/72534\/"},"modified":"2025-10-11T19:32:09","modified_gmt":"2025-10-11T19:32:09","slug":"advanced-design-for-high%e2%80%91performance-and-ai-chips","status":"publish","type":"post","link":"https:\/\/www.newsbeep.com\/nz\/72534\/","title":{"rendered":"Advanced design for high\u2011performance and AI chips"},"content":{"rendered":"<p>                <a href=\"https:\/\/www.eurekalert.org\/multimedia\/1095758\" rel=\"nofollow noopener\" target=\"_blank\"><\/p>\n<p>                    <img decoding=\"async\" src=\"https:\/\/www.newsbeep.com\/nz\/wp-content\/uploads\/2025\/10\/1760211129_924_Public.jpeg\" alt=\"Advanced Design for High\u2011Performance and AI Chips\"\/><\/p>\n<p>                <\/a><\/p>\n<p>image:\u00a0<br \/>\n\tA comprehensive review focused on the recent advancement of the advanced and artificial intelligence (AI) chip is presented.<br \/>\n\tThe design tactics for the enhanced and AI chips can be conducted from a diversity of aspects, with materials, circuit, architecture, and packaging technique taken into considerations, for the pursuit of multimodal data processing abilities, robust reconfigurability, high energy efficiency, and enhanced computing power.<br \/>\n\tA broad outlook on the future considerations of the advanced chip is put forward.<\/p>\n<p>                  <a href=\"https:\/\/www.eurekalert.org\/multimedia\/1095758\" rel=\"nofollow noopener\" target=\"_blank\">view more\u00a0<\/a><\/p>\n<p class=\"credit\">Credit: Ying Cao, Yuejiao Chen, Xi Fan, Hong Fu, Bingang Xu.<\/p>\n<p style=\"text-align:justify\">As artificial intelligence models grow to billions of parameters, traditional computing architectures face mounting challenges in energy efficiency, processing speed, and hardware scalability. Now, researchers from The Hong Kong Polytechnic University and The Education University of Hong Kong, led by Professor Bingang Xu and Professor Hong Fu, have published a comprehensive review on the advanced design of high-performance and AI chips. This work offers critical insights into next-generation chip technologies that can meet the demands of modern AI applications.<\/p>\n<p style=\"text-align:justify\">Why Advanced AI Chips Matter<\/p>\n<p>\tEnergy Efficiency: Advanced chip designs significantly reduce power consumption, addressing the \u201cenergy wall\u201d in AI computation.<br \/>\n\tMultimodal Processing: These chips enable efficient handling of diverse data types\u2014images, audio, text\u2014through reconfigurable and heterogeneous architectures.<br \/>\n\tBrain-Inspired Computing: By mimicking neural structures, neuromorphic chips offer low-latency, event-driven computation ideal for edge AI and real-time tasks.<\/p>\n<p style=\"text-align:justify\">Innovative Design and Features<\/p>\n<p>\tChip Types: The review covers a wide range of AI chips, including analog-AI accelerators, photonic processors, neuromorphic systems, and quantum chips, each optimized for specific AI workloads.<br \/>\n\tFunctional Materials: Emphasis is placed on emerging materials such as phase-change memory (PCM), resistive RAM (RRAM), and 2D semiconductors that enable high-density, low-power computation.<br \/>\n\tIntegration Techniques: Advanced packaging and 3D integration methods, such as monolithic 3D (M3D) and van der Waals lamination, are introduced to overcome scaling limits and improve system performance.<\/p>\n<p style=\"text-align:justify\">Applications and Future Outlook<\/p>\n<p>\tIn-Memory Computing: By merging memory and computation, these chips eliminate the von Neumann bottleneck, enabling faster and more energy-efficient AI inference and training.<br \/>\n\tEdge AI: Neuromorphic and asynchronous chips are tailored for smart sensors, IoT, and autonomous systems, offering ultra-low power and real-time responsiveness.<br \/>\n\tPhotonic and Quantum Acceleration: Photonic chips deliver ultra-high-speed processing using light, while quantum chips promise exponential speedups for specific AI tasks.<br \/>\n\tChallenges and Opportunities: The review highlights key challenges such as material stability, hardware-algorithm co-design, and system-level integration. Future research will focus on scalable fabrication, dynamic reconfigurability, and sustainable materials.<\/p>\n<p>This comprehensive review provides a strategic roadmap for the development of advanced AI chips. It underscores the importance of interdisciplinary collaboration across materials science, electronics, and computer science to drive innovation in AI hardware. Stay tuned for more groundbreaking work from Professor Bingang Xu and Professor Hong Fu!<\/p>\n<p>                            Journal<\/p>\n<p>Nano-Micro Letters<\/p>\n<p>                            Method of Research<\/p>\n<p>Experimental study<\/p>\n<p>                            Article Title<\/p>\n<p>Advanced Design for High\u2011Performance and AI Chips<\/p>\n<p>                            Article Publication Date<\/p>\n<p>29-Jul-2025<\/p>\n<p>Disclaimer: AAAS and EurekAlert! are not responsible for the accuracy of news releases posted to EurekAlert! by contributing institutions or for the use of any information through the EurekAlert system.<\/p>\n","protected":false},"excerpt":{"rendered":"image:\u00a0 A comprehensive review focused on the recent advancement of the advanced and artificial intelligence (AI) chip is&hellip;\n","protected":false},"author":2,"featured_media":72535,"comment_status":"","ping_status":"","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[21],"tags":[371,111,139,69,145],"class_list":{"0":"post-72534","1":"post","2":"type-post","3":"status-publish","4":"format-standard","5":"has-post-thumbnail","7":"category-computing","8":"tag-computing","9":"tag-new-zealand","10":"tag-newzealand","11":"tag-nz","12":"tag-technology"},"_links":{"self":[{"href":"https:\/\/www.newsbeep.com\/nz\/wp-json\/wp\/v2\/posts\/72534","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.newsbeep.com\/nz\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/www.newsbeep.com\/nz\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/www.newsbeep.com\/nz\/wp-json\/wp\/v2\/users\/2"}],"replies":[{"embeddable":true,"href":"https:\/\/www.newsbeep.com\/nz\/wp-json\/wp\/v2\/comments?post=72534"}],"version-history":[{"count":0,"href":"https:\/\/www.newsbeep.com\/nz\/wp-json\/wp\/v2\/posts\/72534\/revisions"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/www.newsbeep.com\/nz\/wp-json\/wp\/v2\/media\/72535"}],"wp:attachment":[{"href":"https:\/\/www.newsbeep.com\/nz\/wp-json\/wp\/v2\/media?parent=72534"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/www.newsbeep.com\/nz\/wp-json\/wp\/v2\/categories?post=72534"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/www.newsbeep.com\/nz\/wp-json\/wp\/v2\/tags?post=72534"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}