Electronic devices - United Kingdom News Beep

Anchoring-assisted intermediate direct pinning process The broad phase distribution of quasi-2D perovskites is mainly attributed to the rapid…

Composites construction The schematic representation of bulk/interface by mutual diffusion of metal atoms to achieve FeSiAl:Sn/Al2O3 is depicted…

Joo, K. et al. High performance package-level EMI shielding of Ag epoxy composites with spray method for high…

Šmejkal, L., Sinova, J. & Jungwirth, T. Beyond conventional ferromagnetism and antiferromagnetism: a phase with nonrelativistic spin and…

Shekhar, S. et al. Roadmapping the next generation of silicon photonics. Nat. Commun. 15, 1–15 (2024). Article Google…

RNPU fabrication and room-temperature operation A lightly n-doped silicon wafer (resistivity ρ ≈ 5 Ω cm) is cleaned and heated for 4 h…

Mead, C. Neuromorphic electronic systems. Proc. IEEE 78, 1629–1636 (1990). Original article launching the field of neuromorphic electronic…

Li, S., Xu, L. D. & Zhao, S. The internet of things: a survey. Inf. Syst. Front. 17,…

Wang, Z., Zhang, B. & Guan, D. Take responsibility for electronic-waste disposal. Nature 536, 23–25 (2016). CAS Google…

Modifying the crystal symmetry in a quantum material is one of the most important routes to manifesting sizeable…