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<\/p>\nDAC 2026: The next step in the partnership of Cadence and Intel Foundry collaboration was announced.<\/p>\n
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Cadence\u2019s AI-driven digital and custom reference flows and tools are now certified on Intel 18A-P and 14A technolgies, based on the latest Intel Foundry process design kits (PDKs).<\/p>\n
The two companies have co-optimised tools, flows, and methodologies for Intel 18A, Intel 18A-P, and Intel 14A, including RibbonFET Gate-all-around transistors and power delivery technologies such as PowerVia and PowerDirect.<\/p>\n
The certified digital and custom reference flows cover AI-driven implementation, verification, and signoff, including synthesis, place-and-route, timing and power signoff, physical verification, reliability verification, and analogue\/custom design.<\/p>\n
The two companies have co-developed an advanced packaging reference design flow that supports Intel Foundry\u2019s Embedded Multi-die Interconnect Bridge (EMIB) and EMIB-T technologies. It eliminates data conversion steps to streamline the workflow of multi-chiplet architectures, says Cadence. It enables concurrent design activities, and provides early thermal, signal integrity, and power integrity analysis across dies and packages.<\/p>\n
The partners have also validated IP test chips in silicon on Intel 18A using Cadence interface and memory IP, demonstrating robust interoperability between Cadence IP, AI-driven flows, and Intel Foundry\u2019s power delivery optimised process technologies.<\/p>\n
Intel 14A is expected to deliver the same power but with higher performance than Intel 18A. Potential applications are AI accelerators, cloud and edge HPC and premium mobile applications. Cadence<\/a> also speculates that in time, it will be used for aerospace and government designs.<\/p>\n