Catalin Palade
Part of the Rising Stars 30 — a list of the UK’s most talented young tech professionals in…
Understanding nature with old smartphones and new technology – The NAU Review
In a groundbreaking twist on a long-standing scientific endeavor, Andrew Richardson, a Regents’ Professor in the School of…
Oracle, GameStop, Synopsys, and More
Key Takeaways The S&P 500 and Nasdaq climbed to record highs Wednesday following a report showing wholesale inflation…
IMAGO’s New AGE-X6 Platform Scales Performance Without System Redesigns
By Chad Cox Production Editor Embedded Computing Design September 10, 2025 News Image Credit: IMAGO IMAGO Technologies released…
DoE selects MIT to establish a Center for the Exascale Simulation of Coupled High-Enthalpy Fluid–Solid Interactions | MIT News
The U.S. Department of Energy’s National Nuclear Security Administration (DoE/NNSA) recently announced that it has selected MIT to establish…
Why simplicity is the new innovation
Forward-thinking organisations are increasingly focusing on simplification, with the most resilient enterprises learning to combine multiple strategies Over…
Register for the new Qiskit v2.X developer certification
With the release of Qiskit SDK v2.X earlier this year, it’s time to update our developer certification to…
What’s The Downside Risk For Rigetti Computing?
Rigetti Computing’s stock is up a stellar 2,000% in a year. But why? It was really a perfect…
University of Utah approves $50M A.I. project to speed up cancer research
The U. will join forces with two private companies: NVIDIA and Hewlett Packard Enterprise. (Francisco Kjolseth | The…
Spatial Computing Industry Forecasted to Grow at a 23.4% CAGR,
Spatial Computing Market The global spatial computing market is undergoing rapid transformation, reshaping how individuals and enterprises interact…
USA pulls out of international push against disinformation
Trump policy condemned as “unilateral act of disarmament” in global information war Image: President Trump, who coined the…
Lam Research Launches VECTOR TEOS 3D Chip Packaging Tool for AI Computing
Inter-Die Gapfill Tool Expands Industry-Leading Portfolio of Solutions for 3D Integration and Chiplet Technologies; Paves Way for New,…