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<\/p>\nPress Release<\/p>\n
\n July 30, 2025\n <\/p>\n
<\/p>\n
Teledyne HiRel Semiconductors, a leader in ruggedized semiconductors for mission-critical environments, today announced the release of the TDD416Y12NEPBM01, a compact DDR4 memory module, screened and qualified as an Enhanced Product (EP) and rated for operation from \u201340\u00b0C to +105\u00b0C.<\/p>\n
The TDD416Y12NEPBM01, is a compact, solder-down DDR4-3200 memory solution that delivers high bandwidth in a dramatically reduced footprint \u2013 smaller than a postage stamp.\u00a0 Packaged in a 216-ball BGA measuring just 22mm x 22mm, it is engineered for systems where board space is limited and performance is critical.<\/p>\n
Its streamlined design integrates memory, termination, and passives into a single unified 22mm2 module \u2014 effectively replacing multiple discrete components and simplifying layout complexity.\u00a0 Unlike monolithic ECC memory modules, the TDD416Y12NEPBM01 supports error correction through an optional companion ECC. This architecture offers key technical advantages such as thermal isolation, design flexibility and cost savings.<\/p>\n
The TDD416Y12NEPBM01 module was developed to meet the growing need for embedded platforms that demand high-speed memory in tight enclosures. Whether routing alongside modern SoCs, CPUs, or FPGAs, the module offers clean signal integrity, and thermal flexibility. It pairs well with processors that support x64 or x72 memory buses, including, Xilinx Versal, Microchip PolarFire, NXP Layerscape, Xilinx Ultrascale+, Intel Atom, as well as Teledyne\u2019s own LS1046-Space and a wide range of ARM-based compute cores.\u00a0 In keeping with industry trends, the DDR4 delivers 42% power savings, 42% jitter reduction, and 39% PK\/PK savings when compared to traditional SODIMMs.<\/p>\n
\u201cThis module approach gives customers the freedom to tailor reliability to each mission profile,\u201d said Mont Taylor, Vice President of Business Development at Teledyne HiRel. \u201cIt\u2019s ideal for mixed deployments.\u00a0 The real strength of the TDD416Y12NEPBM01 lies in its versatility \u2014 socketless installation, reduced BOM, and a fully self-contained design.\u00a0 We’re helping system architects shrink their memory footprint without sacrificing bandwidth.\u201d<\/p>\n
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