![\"A](\"https:\/\/cdn.wccftech.com\/wp-content\/uploads\/2026\/07\/AMD-EPYC-Venice-256-Core-Zen-6-CPU-_2.jpg\")
<\/a>Image Source: Computerbase<\/p>\nAt Advancing AI 2026, AMD has confirmed <\/a>to launch its EPYC Venice CPUs based on the Zen 6 core architecture. But while there are still a few hours left in the official presentation, the company has set banners across the Moscone Center West in San Francisco, US. One of these banners featured a very peculiar-looking chip as spotted by Computerbase<\/a>, and it turns out to be none other than the flagship 256-core EPYC champion.<\/p>\n AMD is leveraging its brand new Zen 6 core architecture that will be used on its 6th Gen EPYC CPUs<\/a>, codenamed Venice. AMD’s EPYC Venice chips are the first HPC product to enter volume production<\/a> on TSMC’s 2nm process technology, and their readiness for Helios AI racks<\/a> proves that AMD will always deliver the best of the best for its high-performance customers.<\/p>\n The TSMC 2nm process technology transitions from FinFET to Nanosheet transistors (GAA), and offers 10-15% higher performance at the same power, 25-30% lower power consumption at the same performance, and up to 15% higher transistor density.<\/p>\n AMD’s 6th Gen EPYC Venice CPUs were teased earlier this year at CES, offering up to 256 cores and 512 threads with eight massive compute dies and two even larger I\/O dies. You can also see that each of the eight massive CCDs features a total of 32 cores, sliced into two 16-core complexes. The IO chips in the middle look massive in size, with lots of controllers such as PCIe 6.0, UCIe, DDR5, and more.<\/p>\n \t\t\t\t\t \t\t\t\t For this chip, AMD has promised over 70% performance & efficiency improvement with its EPYC Venice CPUs, with a >30% increase in thread density.<\/p>\n Once again, the requirement for high-performance CPUs has risen tenfold with Agentic AI workloads. And competitors are firing across all cylinders with CPUs that are optimized around agents. Just like GPUs, NVIDIA is AMD’s primary competitor in this space, which is leveraging Vera CPUs based on its custom Arm IP to power the Vera Rubin NVL72 racks<\/a>. AMD’s Helios AI racks powered by Zen 6 EPYC chips not only offer more cores, but faster performance and improved single-core capabilities, which is important for sustained throughput.<\/p>\n In early benchmarks<\/a>, AMD has shown that not only do its 5th Gen Turin “Zen 5” CPUs lead against Vera, but the 6th Gen Venice “Zen 6” chips lead massively, driving more performance & offering better TCOs at a similar power scale.<\/p>\n AMD EPYC CPU Families:<\/p>\n \tFamily NameAMD EPYC VeranoAMD EPYC Venice-DenseAMD EPYC VeniceAMD EPYC Turin-XAMD EPYC Turin-DenseAMD EPYC TurinAMD EPYC SienaAMD EPYC BergamoAMD EPYC Genoa-XAMD EPYC GenoaAMD EPYC Milan-XAMD EPYC MilanAMD EPYC RomeAMD EPYC Naples<\/p>\n \tFamily BrandingEPYC 9007EPYC 9006EPYC 9006EPYC 9005EPYC 9005EPYC 9005EPYC 8004EPYC 9004EPYC 9004EPYC 9004EPYC 7004EPYC 7003EPYC 7002EPYC 7001<\/p>\n \tFamily Launch20272026202620252025202420232023202320222022202120192017<\/p>\n \tCPU ArchitectureZen 6+Zen 6CZen 6Zen 5Zen 5CZen 5Zen 4Zen 4CZen 4 V-CacheZen 4Zen 3Zen 3Zen 2Zen 1<\/p>\n \tProcess NodeTBD2nm TSMC2nm TSMC4nm TSMC3nm TSMC4nm TSMC5nm TSMC4nm TSMC5nm TSMC5nm TSMC7nm TSMC7nm TSMC7nm TSMC14nm GloFo<\/p>\n \tPlatform NameSP7SP7SP7SP5SP5SP5SP6SP5SP5SP5SP3SP3SP3SP3<\/p>\n \tSocketTBDTBDTBDLGA 6096 (SP5)LGA 6096 (SP5)LGA 6096LGA 4844LGA 6096LGA 6096LGA 6096LGA 4094LGA 4094LGA 4094LGA 4094<\/p>\n \tMax Core CountTBD2569612819212864128969664646432<\/p>\n \tMax Thread CountTBD51219225638425612825619219212812812864<\/p>\n \tMax L3 CacheTBD1024 MB? (128 MB \/CCD)384 MB? (48 MB\/CCD)1536 MB384 MB384 MB256 MB256 MB1152 MB384 MB768 MB256 MB256 MB64 MB<\/p>\n \tChiplet DesignTBD8 CCD’s (1 CCX per CCD) + 2 IOD?8 CCD’s (1 CCX per CCD) + 2 IOD16 CCD’s (1CCX per CCD) + 1 IOD12 CCD’s (1CCX per CCD) + 1 IOD16 CCD’s (1CCX per CCD) + 1 IOD8 CCD’s (1CCX per CCD) + 1 IOD12 CCD’s (1 CCX per CCD) + 1 IOD12 CCD’s (1 CCX per CCD) + 1 IOD12 CCD’s (1 CCX per CCD) + 1 IOD8 CCD’s (1 CCX per CCD) + 1 IOD8 CCD’s (1 CCX per CCD) + 1 IOD8 CCD’s (2 CCX’s per CCD) + 1 IOD4 CCD’s (2 CCX’s per CCD)<\/p>\n \tMemory SupportTBDDDR5-8000+DDR5-8000+DDR5-6400DDR5-6400DDR5-6400DDR5-5200DDR5-5600DDR5-4800DDR5-4800DDR4-3200DDR4-3200DDR4-3200DDR4-2666<\/p>\n \tMemory ChannelsTBD16-Channel (SP7)16-Channel (SP7)12 Channel (SP5)12 Channel12 Channel6-Channel12 Channel12 Channel12 Channel8 Channel8 Channel8 Channel8 Channel<\/p>\n \tPCIe Gen SupportTBD128-192 PCIe Gen 6128-192 PCIe Gen 6TBD128 PCIe Gen 5128 PCIe Gen 596 Gen 5128 Gen 5128 Gen 5128 Gen 5128 Gen 4128 Gen 4128 Gen 464 Gen 3<\/p>\n \tTDP (Max)TBD~600W~600W500W (cTDP 600W)500W (cTDP 450-500W)400W (cDP 320-400W)70-225W320W (cTDP 400W)400W400W280W280W280W200W<\/p>\n \t\t\t\t\t\t\t\t\t \n\t\t\t\t\tAbout the author<\/a>: A Software Engineer by training and a PC enthusiast by passion, Hassan Mujtaba serves as Wccftech’s Senior Editor for hardware<\/a> section. With years of experience in the industry, he specializes in deep-dive technical analysis of next-generation CPU and GPU architectures, motherboards, and cooling solutions. His work involves not only breaking news on upcoming technologies but also extensive hands-on reviews and benchmarking.\t\t\t\t<\/p>\n
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\n\t\t\t\t<\/a><\/p>\n<\/a>Image Source: AMD<\/p>\n
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