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<\/a><\/a><\/p>\nAccording to McKinsey & Company, quantum computing could create up to $2.7 trillion of economic value worldwide by 2035 (1). As quantum computing advances beyond early research demonstrations toward increasingly capable systems, one of the industry\u2019s greatest challenges is scaling the number of qubits\u2014the fundamental units of quantum information\u2014while maintaining the performance and reliability needed for practical applications. Because qubits are extremely sensitive to errors, achieving fault-tolerant quantum computing requires significantly increasing the number of physical qubits to support error correction.<\/p>\n
Meeting these requirements presents significant manufacturing challenges. Different quantum computing architectures rely on a wide range of materials and device structures, creating demanding requirements for high-density interconnections, heterogeneous materials integration and precision manufacturing. Advanced packaging technologies will play a key role in enabling the integration of increasingly complex quantum chips and other critical components while preserving their performance.<\/p>\n
EVG addresses these challenges through its broad portfolio of process technologies, including fusion and hybrid bonding, high-vacuum oxide-free bonding, digital and nanoimprint lithography, and thin-wafer processing. These technologies provide the precision needed for demanding wafer alignment, bonding and patterning requirements across different quantum computing architectures. Combined with the company\u2019s materials and process integration expertise through its Heterogeneous Integration Competence Center\u2122 (HICC) and NILPhotonics\u00ae Competence Center, these capabilities enable quantum computing companies to explore, develop and validate new quantum chip designs and manufacturing approaches.<\/p>\n
\u201cQuantum computing is not a single technology, but a collection of fundamentally different approaches, each with its own materials and manufacturing requirements. As developers work to scale these technologies, the challenge is not simply increasing the number of\u00a0qubits but finding ways to integrate them in increasingly complex chip architectures without compromising performance,\u201d stated Dr. Bernd Dielacher, director of business development at EVG. \u201cThis is where EVG\u2019s broad portfolio of process solutions, combined with our experience in advanced packaging and heterogeneous integration, can play an important role in helping customers develop practical manufacturing solutions for a new generation of quantum devices.\u201d<\/p>\n
Process Technologies Supporting Quantum Computing Development<\/p>\n
Quantum computing encompasses a variety of approaches, including superconducting, photonic, spin, trapped-ion, neutral-atom and nitrogen-vacancy diamond qubits, each presenting distinct materials and manufacturing challenges. EVG\u2019s technologies address a range of manufacturing requirements across different quantum computing approaches.<\/p>\n
For example, with superconducting quantum devices, oxide-free bonding processes can support the formation of superconducting interconnects and 3D device integration. In photonic quantum devices, fusion and oxide-free bonding enable the integration of III-V and high-Pockels-coefficient materials on waveguides, while hybrid bonding supports ultra-high-density interconnects in emerging spin qubit architectures. For trapped ion quantum computing, EVG has collaborated with researchers to develop low-temperature metal bonding processes that enable the integration of ion-trap and photonic chiplets made from different substrate materials. EVG is also a strategic partner of Silicon Austria Labs in support of the CHAMP-ION<\/a>\u00a0pilot line project, Europe\u2019s first open-access pilot line for industrial-scale production of ion-trap quantum chips. Additional capabilities, including nanoimprint lithography, digital lithography and temporary bonding and debonding, can support specialized optical structures and advanced packaging processes.<\/p>\n